Shri Mata Vaishno Devi University
Official Website     Last Updated: 29th Jun, 2024
Admission 2024-25
Shri Mata Vaishno Devi University
Official Website     Last Updated: 29th Jun, 2024
Admission 2024-25

Indo US Workshop on Next Generation Logistics in SMVDU

13082019 news

Kakryal: Indo US one week Workshop on “Next Generation Logistics, Logistic Models and Supply Chains” started in Shri Mata Vaishno Devi University. This workshop is approved and partially sponsored by Indo-US Science and technology Forum (IUSSTF) being organized jointly by Department of Industrial Engineer, University of Pittsburgh, and Institution for innovation, Industrial Engineering and Entrepreneurship (IIIEE), India with support from the Institute of Industrial & System Engineers, at SMVDU, Katra, J&K. The first of its kind workshop is aimed at promoting the State of Art research in the Supply Chain Management and logistics. Chief Guest, Hon’ble Vice Chancellor, Professor, D. Mukhopadhyay inaugurated the IUSSTF workshop and congratulated the organisers, participants and, further addressed issues, importance of supply chain management in Industries. Professor Eswaramoorthy M., Dean, Faculty of Engineering and Dr. RK Mishra, Head, School of Mechanical Engineering, welcomed all participants to first Indo US workshop in SMVDU. Three Professors from premier USA universities are spokespersons for this workshop. Dr. Tapas Das, Professor & Department Chair, School of Engineering, University of South Florida, Dr. Bopaya Didanda, Ernest Roth Professor & Department Chair, Swanson School of Engineering, University of Pittsburgh, Dr. Sunderesh S. Heragu, Professor & Department Chair, School of Industrial Engineering, Oklahoma State University and Dr. Bhaskar Bhandarkar, Director General, IIIEE are conducting sessions in the workshop. Dr. Balbir Singh, Associate Professor from School of Mechanical of Engineering is coordinating the workshop in SMVDU. Faculty members across the country and students of M.Tech (M&A) from SMVDU are attending this workshop.

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